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74ABT646A
Octal bus transceiver/register; 3-state
Rev. 03 -- 15 March 2010 Product data sheet
1. General description
The 74ABT646A high-performance BiCMOS device combines low static and dynamic power dissipation with high speed and high output drive. The 74ABT646A transceiver/register consists of bus transceiver circuits with 3-state outputs, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or the internal registers. Data on the A bus or B bus will be clocked into the registers as the appropriate clock pin (CPAB or CPBA) goes HIGH. Output Enable (OE) and Direction (DIR) pins are provided to control the transceiver function. In the transceiver mode, data present at the high-impedance port may be stored in either the A or B register or both. The Select (SAB, SBA) pins determine whether data is stored or transferred through the device in real-time. The DIR pin determines which bus receives data when OE is active (LOW). In isolation mode (OE = HIGH), data from bus A may be stored in the B register and/or data from bus B may be stored in the A register. When an output function is disabled, the input function is still enabled and may be used to store and transmit data. Only one of the two buses, A or B, may be driven at a time. The examples in Figure 5 "Real time bus transfer and storage" on page 6 demonstrate the four fundamental bus management functions that can be performed with the 74ABT646A.
2. Features and benefits
I I I I I I I I I Combines 74ABT245 and 74ABT373A type functions in one device Independent registers for A and B buses Multiplexed real-time and stored data Live insertion and extraction permitted Output capability: +64 mA to -32 mA Power-up 3-state Power-up reset Latch-up protection exceeds 500 mA per JESD78B class II level A ESD protection: N HBM JESD22-A114F exceeds 2000 V N MM JESD22-A115-A exceeds 200 V
NXP Semiconductors
74ABT646A
Octal bus transceiver/register; 3-state
3. Ordering information
Table 1. Ordering information Package Temperature range 74ABT646AD 74ABT646ADB 74ABT646APW -40 C to +85 C -40 C to +85 C -40 C to +85 C Name SO24 SSOP24 TSSOP24 Description Version Type number
plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 plastic shrink small outline package; 24 leads; body width 5.3 mm plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT340-1 SOT355-1
4. Functional diagram
21
G3 3EN1[BA]
3 22 4 5 6 7 8 9 10 11 2 23 1 2 3 23 22 21 A0 A1 A2 A3 A4 A5 A6 A7 CPAB SAB DIR CPBA SBA OE B0 B1 B2 B3 B4 B5 B6 B7 20 19 18 17 16 15 14 13
001aae891
3EN2[AB] G6 G7 C4 C5 1 7 7 6 6 1 4D 1 2 19 18 17 16 15 14 13
001aae892
1
4
20
1 5D
5 6 7 8 9 10 11
1
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
74ABT646A_3
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Product data sheet
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74ABT646A
Octal bus transceiver/register; 3-state
OE
21
DIR CPBA SBA CPAB SAB
3 23 22 1 2
1 of 8 channels
1D C1 Q
A0
4 1D C1 Q
20
B0
A1 A2 A3 A4 A5 A6 A7
5 6 7 8 9 10 11
DETAIL A x 7
19 18 17 16 15 14 13
001aae894
B1 B2 B3 B4 B5 B6 B7
Fig 3.
Logic diagram
74ABT646A_3
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Product data sheet
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74ABT646A
Octal bus transceiver/register; 3-state
5. Pinning information
5.1 Pinning
74ABT646A
CPAB SAB DIR A0 A1 A2 A3 A4 A5 1 2 3 4 5 6 7 8 9 24 VCC 23 CPBA 22 SBA 21 OE 20 B0 19 B1 18 B2 17 B3 16 B4 15 B5 14 B6 13 B7
001aae890
A6 10 A7 11 GND 12
Fig 4.
Pin configuration
5.2 Pin description
Table 2. Symbol CPAB SAB DIR A0, A1, A2, A3, A4, A5, A6, A7 GND B0, B1, B2, B3, B4, B5, B6, B7 OE SBA CPBA VCC Pin description Pin 1 2 3 4, 5, 6, 7, 8, 9, 10, 11 12 20, 19, 18, 17, 16, 15, 14, 13 21 22 23 24 Description A to B clock input A to B select input direction control input data input/output (A side) ground (0 V) data input/output (B side) output enable input (active LOW) B to A select input B to A clock input positive supply voltage
74ABT646A_3
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74ABT646A
Octal bus transceiver/register; 3-state
6. Functional description
Table 3. Inputs OE X X H H L L L L
[1]
Function table[1] Data I/O DIR X X X X L L H H CPAB X H or L X X X H or L CPBA X H or L X H or L X X SAB X X X X X X L H SBA X X X X L H X X An input unspecified output[2] input input output output input input Bn unspecified output[2] input input input input input output output store A, B unspecified store B, A unspecified store A and B data isolation, hold storage real time B data to A bus stored B data to A bus real time A data to B bus stored A data to B bus Operating mode
H = HIGH voltage level; L = LOW voltage level; X = don't care; = LOW-to-HIGH clock transition; The data output function may be enabled or disabled by various signals at the OE input. Data input functions are always enabled, i.e. data at the bus pins will be stored on every LOW-to-HIGH transition of the clock.
[2]
74ABT646A_3
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Product data sheet
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xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Product data sheet Rev. 03 -- 15 March 2010 6 of 19
74ABT646A_3
NXP Semiconductors
REAL TIME BUS TRANSFER BUS B TO BUS A
REAL TIME BUS TRANSFER BUS A TO BUS B
STORAGE FROM A, B, OR A AND B
TRANSFER STORED DATA TO A OR B
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A
B
A
B
A
B
A
B
Octal bus transceiver/register; 3-state
OE L
DIR L
CPAB CPBA X X
SAB X
SBA L
OE L
DIR H
CPAB CPBA X X
SAB L
SBA X
OE L L H
DIR H L X
CPAB CPBA X X
SAB X X X
SBA X X X
OE L L
DIR L H
CPAB CPBA X H/L H/L X
SAB X H
SBA H X
001aae893
74ABT646A
Fig 5.
Real time bus transfer and storage
NXP Semiconductors
74ABT646A
Octal bus transceiver/register; 3-state
7. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VI VO IIK IOK IO Tj Tstg
[1] [2]
Parameter supply voltage input voltage output voltage input clamping current output clamping current output current junction temperature storage temperature
Conditions
[1]
Min -0.5 -1.2 -0.5 -18 -50 [2]
Max +7.0 +7.0 +5.5 128 150 +150
Unit V V V mA mA mA C C
output in OFF-state or HIGH-state VI < 0 V VO < 0 V output in LOW-state
[1]
-65
The input and output voltage ratings may be exceeded if the input and output current ratings are observed. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 C.
8. Recommended operating conditions
Table 5. Symbol VCC VI VIH VIL IOH IOL t/V Tamb Recommended operating conditions Parameter supply voltage input voltage HIGH-level input voltage LOW-level input voltage HIGH-level output current LOW-level output current input transition rise and fall rate ambient temperature in free air Conditions Min 4.5 0 2.0 -32 0 -40 Typ Max 5.5 VCC 0.8 64 10 +85 Unit V V V V mA mA ns/V C
74ABT646A_3
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74ABT646A
Octal bus transceiver/register; 3-state
9. Static characteristics
Table 6. Static characteristics Conditions Min VIK VOH input clamping voltage HIGH-level output voltage VCC = 4.5 V; IIK = -18 mA VI = VIL or VIH VCC = 4.5 V; IOH = -3 mA VCC = 5.0 V; IOH = -3 mA VCC = 4.5 V; IOH = -32 mA VOL VOL(pu) II LOW-level output voltage VCC = 4.5 V; IOL = 64 mA; VI = VIL or VIH power-up LOW-level output voltage input leakage current VCC = 5.5 V; IO = 1 mA; VI = GND or VCC VCC = 5.5 V; VI = GND or 5.5 V control pins data pins IOFF IO(pu/pd) IOZ power-off leakage current VCC = 0 V; VI or VO 4.5 V power-up/power-down output current OFF-state output current VCC = 2.1 V; VO = 0.5 V; VI = GND or VCC; OE HIGH VCC = 5.5 V; VI = VIL or VIH VO = 2.7 V VO = 0.5 V ILO output leakage current VCC = 5.5 V; HIGH-state; VO = 5.5 V; VCC = 5.5 V; VI = GND or VCC VCC = 5.5 V; VO = 2.5 V VCC = 5.5 V; VI = GND or VCC outputs HIGH-state outputs LOW-state outputs disabled ICC CI CI/O additional supply current input capacitance input/output capacitance per input pin; VCC = 5.5 V; one input at 3.4 V; other inputs at VCC or GND control pins; VI = 0 V or VCC I/O pins; outputs disabled; VO = 0 V or VCC
[4] [3][5] [2] [1]
Symbol Parameter
25 C Typ -0.9 3.0 3.5 2.4 0.3 0.13 Max 0.55 0.55 -1.2 2.5 3.0 2.0 -
-40 C to 85 C Unit Min -1.2 2.5 3.0 2.0 Max 0.55 0.55 V V V V V V
-
0.0 1 5 5.0
1.0 100 50
-
1.0 100 100 50
A A A A
5.0 100
-
5.0 -5.0 5.0
50 -50 50
-
50 -50 50
A A A
IO ICC
output current supply current
-180 -
-65 110 20 110 0.6 4 7
-40 250 30 250 1.5 -
-180 -
-40 250 30 250 1.5 -
mA A mA A mA pF pF
[1] [2] [3] [4] [5]
For valid test results, data must not be loaded into the flip-flops (or latches) after applying the power. This parameter is valid for any VCC between 0 V and 2.1 V with a transition time of up to 10 ms. For VCC = 2.1 V to VCC = 5 V 10 %, a transition time of up to 100 s is permitted. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. This is the increase in supply current for each input at 3.4 V. This data sheet limit may vary among suppliers.
74ABT646A_3
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74ABT646A
Octal bus transceiver/register; 3-state
10. Dynamic characteristics
Table 7. Dynamic characteristics GND = 0 V; for test circuit, see Figure 11. Symbol Parameter Conditions 25 C; VCC = 5.0 V Min fmax tPLH maximum frequency LOW to HIGH propagation delay see Figure 6 CPAB to Bn or CPBA to An; see Figure 6 An to Bn or Bn to An; see Figure 7 SAB to Bn or SBA to An; see Figure 7 tPHL HIGH to LOW propagation delay CPAB to Bn or CPBA to An; see Figure 6 An to Bn or Bn to An; see Figure 7 SAB to Bn or SBA to An; see Figure 7 tPZH tPZL tPHZ tPLZ tsu(H) tsu(L) th(H) th(L) tWH tWL
[1]
-40 C to +85 C; Unit VCC = 5.0 V 0.5 V Min 125 2.2 1.5 1.5 1.7 1.5 1.5 1.5 1.2 3.0 2.5 1.5 1.5 1.5 1.5 3.0 3.0 0.0 0.0 4.0 4.0 Max 5.6 4.8 6.5 5.6 5.4 5.9 6.3 6.7 8.8 9.5 5.3[1] 5.7 4.5 6.0 MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Typ 350 3.9 3.2 3.8 4.4 3.7 4.4 3.5 3.9 4.5 4.7 4.0 4.0 3.3 3.5 0.7 0.7 -0.5 -0.5 0.9 1.4
Max 5.1 4.3 5.1 5.2[1] 4.6 5.3[1] 5.3 5.7 7.4 9.0 4.8[1] 5.0 4.0 4.7 -
125 2.2 1.5 1.5 1.7 1.5 1.5 1.5 1.5 3.0 2.5 1.5 1.5 1.5 1.5 3.0 3.0 +0.0 +0.0 4.0 4.0
OFF-state to HIGH propagation delay OFF-state to LOW propagation delay HIGH to OFF-state propagation delay LOW to OFF-state propagation delay set-up time HIGH set-up time LOW hold time HIGH hold time LOW pulse width HIGH pulse width LOW
OE to An or Bn; see Figure 8 DIR to An or Bn; see Figure 8 OE to An or Bn; see Figure 9 DIR to An or Bn; see Figure 9 OE to An or Bn; see Figure 8 DIR to An or Bn; see Figure 8 OE to An or Bn; see Figure 9 DIR to An or Bn; see Figure 9 An to CPAB, Bn to CPBA; see Figure 10 An to CPAB, Bn to CPBA; see Figure 10 An to CPAB, Bn to CPBA; see Figure 10 An to CPAB, Bn to CPBA; see Figure 10 CPAB, CPBA; see Figure 6 LE; see Figure 6
This data sheet limit may vary among suppliers.
74ABT646A_3
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74ABT646A
Octal bus transceiver/register; 3-state
11. Waveforms
1 / fmax VI CPBA or CPAB GND tWH tPHL VOH An or Bn VOL VM VM
001aae839
VM
VM tWL
VM
tPLH
VM = 1.5 V VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6.
Propagation delay clock input to output and clock pulse width, maximum clock frequency
VI
SBA or SAB, An or Bn
GND
VM
VM
tPLH VOH
tPHL
An or Bn
VOL
VM
VM
001aae895
VM = 1.5 V VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7.
Propagation delay, SAB to Bn or SBA to An, An to Bn or Bn to An
VI OE, DIR GND tPZH VOH An or Bn GND
001aae896
VM
VM
tPHZ VOH - 0.3 V
VM
VM = 1.5 V VOL and VOH are typical voltage output levels that occur with the output load.
Fig 8.
3-state output enable time to HIGH-level and output disable time from HIGH-level
74ABT646A_3
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74ABT646A
Octal bus transceiver/register; 3-state
VI OE, DIR GND tPZL 3.5 V An or Bn VOL
001aae898
VM
VM
tPLZ
VM
VOL + 0.3 V
VM = 1.5 V VOL and VOH are typical voltage output levels that occur with the output load.
Fig 9.
3-state output enable time to LOW-level and output disable time from LOW-level
VI
An, Bn
VM GND VI tsu(H)
VM th(H)
VM tsu(L) tWL
VM th(L)
CPBA or CPAB
VM GND
VM
001aae849
VM = 1.5 V VOL and VOH are typical voltage output levels that occur with the output load. The shaded areas indicate when the input is permitted to change for predictable output performance.
Fig 10. Data set-up and hold times
74ABT646A_3
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74ABT646A
Octal bus transceiver/register; 3-state
VI negative pulse 0V
tW 90 % VM 10 % tf tr VM 10 % tr tf 90 % VM 10 % tW
001aai298
90 %
VEXT VCC VI VO DUT
RT CL RL RL
G
VI positive pulse 0V
90 % VM 10 %
mna616
a. Input pulse definition
Test data is given in Table 8. RL = Load resistance. CL = Load capacitance including jig and probe capacitance.
b. Test circuit
RT = Termination resistance should be equal to output impedance Zo of the pulse generator. VEXT = Test voltage for switching times.
Fig 11. Load circuitry for switching times Table 8. Input VI 3.0 V fI 1 MHz tW 500 ns tr, tf 2.5 ns Test data Load CL 50 pF RL 500 VEXT tPHL, tPLH open tPZH, tPHZ open tPZL, tPLZ 7.0 V
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74ABT646A
Octal bus transceiver/register; 3-state
12. Package outline
SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 Z
(1)
0.9 0.4
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
0.035 0.004 0.016
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 12. Package outline SOT137-1 (SO24)
74ABT646A_3 All information provided in this document is subject to legal disclaimers. (c) NXP B.V. 2010. All rights reserved.
Product data sheet
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74ABT646A
Octal bus transceiver/register; 3-state
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 12 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 8.4 8.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.8 0.4 8 o 0
o
Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 13. Package outline SOT340-1 (SSOP24)
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Product data sheet
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NXP Semiconductors
74ABT646A
Octal bus transceiver/register; 3-state
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
D
E
A
X
c y HE vMA
Z
24
13
Q A2 pin 1 index A1 (A 3) A
Lp L
1
e bp
12
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 7.9 7.7 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 8o 0o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT355-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19
Fig 14. Package outline SOT355-1 (TSSOP24)
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Product data sheet
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74ABT646A
Octal bus transceiver/register; 3-state
13. Abbreviations
Table 9. Acronym BiCMOS DUT ESD HBM MM Abbreviations Description Bipolar Complementary Metal-Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Machine Model
14. Revision history
Table 10. Revision history Release date 20100315 Data sheet status Product data sheet Change notice Supersedes 74ABT646A_2 Document ID 74ABT646A_3 Modifications:
* * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. DIP 24 (SOT222-1) package removed from Section 3 "Ordering information" and Section 12 "Package outline". Product specification Product specification 74ABT646A_1 -
74ABT646A_2 74ABT646A_1
19980217 19950906
74ABT646A_3
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Octal bus transceiver/register; 3-state
15. Legal information
15.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification -- The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on a weakness or default in the customer application/use or the application/use of customer's third party customer(s) (hereinafter both referred to as "Application"). It is customer's sole responsibility to check whether the NXP Semiconductors product is suitable and fit for the Application planned. Customer has to do all necessary testing for the Application in order to avoid a default of the Application and the product. NXP Semiconductors does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities.
15.3 Disclaimers
Limited warranty and liability -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications -- This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be
74ABT646A_3
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 -- 15 March 2010
17 of 19
NXP Semiconductors
74ABT646A
Octal bus transceiver/register; 3-state
16. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
74ABT646A_3
All information provided in this document is subject to legal disclaimers.
(c) NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 -- 15 March 2010
18 of 19
NXP Semiconductors
74ABT646A
Octal bus transceiver/register; 3-state
17. Contents
1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Recommended operating conditions. . . . . . . . 7 Static characteristics. . . . . . . . . . . . . . . . . . . . . 8 Dynamic characteristics . . . . . . . . . . . . . . . . . . 9 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 17 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Contact information. . . . . . . . . . . . . . . . . . . . . 18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 March 2010 Document identifier: 74ABT646A_3

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